Advanced Electronics Manufacturing -SMT Fabrication
Introduction to Surface Mount Technology (SMT)

19 May 2025 – 30 May 2025

Mode: Offline / In-person Only

Venue: Central Electronics Centre, IIT Madras, Chennai 600036

Surface Mount Technology (SMT) is a method used for producing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). This contrasts with the older through-hole technology, where components have leads that are inserted into holes on the PCB. Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). This allows for smaller and more densely packed electronic devices, as well as faster and more automated assembly processes. SMT has become the industry standard over the past several decades and issued in a wide range of applications.

In the early days of electronics, through-hole technology was the norm, with components inserted into holes drilled in the PCB and then soldered in place. This worked well for larger devices, but as electronics became more miniaturized, it became clear that a new approach was needed. SMT was developed to address these challenges. By mounting components directly onto the surface of the PCB, it became possible to create much smaller and more densely packed devices. Today, SMT is used in virtually all electronic devices, from simple toys to complex medical equipment. It has enabled the development of new technologies, such as flexible and stretchable electronics, that were once thought impossible. As the electronics industry continues to evolve, it is clear that SMT will remain a critical technology for years to come.

Compact Design

SMT components (Surface-Mount Devices, or SMDs) are smaller than their through-hole counterparts, allowing for more components in a given area.

High Automation Potential

SMT processes are highly compatible with automated machinery, enabling faster and more cost-effective production.

Improved Performance

Reduced inductance and capacitance due to shorter leads improve high-frequency performance.

Lightweight & Compact

SMT allows the creation of smaller and lighter electronic devices, catering to the demands of modern electronics.

Why Choose SMT Training at CEC?

This Hands on course designed for 20% theory and 80% practical covers the Advanced Electronics Manufacturing & Assembly, to learn the entire inline assembly process. This training is provided to operate the Solder Paste Printer (Fuji make), Solder Paste Inspection System (KOYUNG), Pick&Place Machine (Yamaha), Reflow oven (Heller) and AOI (KOYUNG).

This course is designed to provide the following:

 

  • Understanding of SMT Components Packages.
  • Understanding and Handling of ESD Safe Components
  • Understanding and handling of Moisture Sensitive Level Components (MSL)
  • Understanding the Simple Circuits and Wiring
  • Understanding of Basic Test and Measuring Instruments
  • Manual Soldering of Through hole Components in general purpose PCB
  • PCB Designing, Component Selection, Component Footprint design, Component symbol design, Component library management, BoM creation and Generation, Component Ordering, Gerber file generation.
  • Introduction about Basic Electronics and hands-on experience about different electronic components (PTH and SMT), Electrical properties, Safe Operating Area, instrumentation measurements.
  • Hands on experience on Circuit Connections, Series Parallel combinations and observing VI Characteristics, De-soldering Techniques, Output verification, Basic level of Hardware Testing.
  • ESD Safety, Solder paste compositions, RoHS, Moisture Sensitivity Level, Solder-paste handling
  • Understanding of Stencil Printing, Type of Stencils and Jet Printing.
  • Hands on experience on programing and operating the In–line Solder Paste Printing machine
  • Hands on experience on programing and operating the In-line Solder Paste Inspection System
  • Hands on experience on programing and operating the In-line Pick & Place machine
  • Hands on experience on operating Reflow Oven and Experiment with Thermal Profiler
  • Understanding Soldering Defects due to process parameter variation
  • Hands on experience on programing and operating the In-line Automatic Optical Inspection System.
  • Hands on experience on SMT BGA rework

    • Highlights of the Programme

    Industry-relevant curriculum

    Designed in collaboration with leading industry experts to deliver hands-on industry in the latest technology & processes in Electronics Manufacturing.

    Placement Support

    CEC IIT Madras will provide placement assistance and connect final-year students & graduates with leading electronics manufacturing companies

    Bridging the Skill Gap

    This course will empower students with the skills required to meet the growing demand for qualified professionals in the Electronics Manufacturing Service(EMS) Industry.

    Course Fee: INR 15,000 + GST

    Register Now